Huawei introduced one of the more surprising products we saw at CES — its incredibly thin Ascend P1 S smartphone (pictured above) certainly marked a break from the inexpensive featurephones the company is typically known for, and it sounds like there’s still more to come. According to a report from TWICE, Huawei is planning to launch a “Diamond” series of smartphones, with performance that will exceed even that of the Ascend P1 S. Device chairman Richard Yu reportedly told TWICE that these phones would be introduced at Mobile World Congress in Barcelona this February, but there’s no other specs given or info on how these phones will best the phones it showed off at CES. It’s hard to imagine them being thinner, but a logical improvement might be a quad-core processor like those we’re starting to hear about in other upcoming smartphones.
Huawei reportedly planning high-end ‘Diamond’ series smartphones for MWC
According to a report from TWICE, Huawei is planning to launch a “Diamond” series of smartphones at Mobile World Congress, with performance that will exceed even that of the Ascend P1 S
According to a report from TWICE, Huawei is planning to launch a “Diamond” series of smartphones at Mobile World Congress, with performance that will exceed even that of the Ascend P1 S
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